PART |
Description |
Maker |
PL00182-WCBG1117 |
Flat lens thin package 3.2 x 2.7 x 1.1mm
|
P-tec Corporation
|
MSCD014SH |
Thin flat package
|
Zowie Technology Corporation
|
PL00100-YDW03 |
Flat lens package 3.2 x 1.6 x 1.1mm
|
P-tec Corporation
|
PL00101-WCG25 |
Flat lens package 3.2 x 1.6 x 1.4mm
|
P-tec Corporation
|
PL00101-WCY22 |
Flat lens package 3.2 x 1.6 x 1.4mm
|
P-tec Corporation
|
PL00123-WCA02 |
Flat lens package 2.0 x 1.25 x 0.8mm
|
P-tec Corporation
|
TQFP44 |
44-Lead Thin Quad Flat Package
|
STMicroelectronics
|
UPA835 UPA835TC UPA835TC-T1 |
NPN SILICON EPITAXIAL TRANSISTOR WITH 2 DIFFERENT ELEMENTS IN A FLAT-LEAD 6-PIN THIN-TYPE ULTRA SUPER MINIMOLD PACKAGE
|
NEC Corp. NEC[NEC]
|
TNPW2010 TNPW0805 TNPW1206 TNPW0402 TNPW1210 TNPW2 |
Ultra-stable thin film technology; Pulse resistant; Thin Film Flat Chip Resistors;
High-Stability Thin Film, Rectangular, Resistor Chips Thin Film/ Rectangular/ Resistor Chips
|
Vishay Intertechnology,Inc. VISAY[Vishay Siliconix]
|
PL00193-WCRG1817 |
Dome lens thin package 3.2 x 1.0 x 1.5mm
|
P-tec Corporation
|
UPA840 UPA840TC UPA840TC-T1 A840 |
NPN SILICON EPITAXIAL TRANSISTOR WITH 2 DIFFERENT ELEMENTS IN A FLAT-LEAD 6-PIN THIN-TYPE ULTRA SUPER MINIMOLD PACKAGE
|
NEC[NEC] NEC Corp.
|
FLPFXX |
LENS CAP / FLP ASSEMBLY, FLAT FACE
|
List of Unclassifed Manufacturers
|